Part Number | 824AG32D |
Main Category | Connectors, Interconnects |
Sub Category | Sockets for ICs, Transistors |
Brand | Texas Instruments |
Description | CONN IC DIP SOCKET 24POS TINLEAD |
Series | 800 |
Packaging | Tube |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 24 (2 x 12) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin-Lead |
Contact Finish Thickness - Mating | 80µin (2.03µm) |
Contact Material - Mating | Copper Alloy |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin-Lead |
Contact Finish Thickness - Post | - |
Contact Material - Post | Copper Alloy |
Housing Material | Polyester |
Operating Temperature | -55°C ~ 105°C |
Image |
824-AG32D
TI/ST
4452
1.15
Dedicate Electronics (HK) Limited
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2.095
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Iconix Inc.