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Description
CONN HEADER 31POS 1MM SMD TIN Series: DF9 Amplifier Type: Header, Center Strip Contacts Applications: 31 Capacitance: 2
Part Number | DF9-31P-1V(32) |
Main Category | Connectors, Interconnects |
Sub Category | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine |
Brand | Texas Instruments |
Description | CONN HEADER 31POS 1MM SMD TIN |
Series | DF9 |
Packaging | Tape & Reel (TR) |
Connector Type | Header, Center Strip Contacts |
Number of Positions | 31 |
Pitch | 0.039" (1.00mm) |
Number of Rows | 2 |
Mounting Type | Surface Mount |
Features | Board Guide, Solder Retention |
Contact Finish | Tin |
Contact Finish Thickness | 39µin (1.00µm) |
Mated Stacking Heights | 4.3mm |
Height Above Board | 0.130" (3.30mm) |
Image | ![]() |
DF9-31P-1V(32)
TI/ST
24500
1.48
Nosin (HK) Electronics Co.
DF9-31P-1V
TexasIns
200
2.2275
Yingxinyuan INT'L (Group) Limited
DF9-31P-1V(32)
TI/CC
30000
2.975
Redstar Electronic Limited
DF9-31P-1V
TI?
28786
3.7225
Shenzhen WTX Capacitor Co., Ltd.
DF9-31P-1V(22)
TI-BB
12447
4.47
CIS Ltd (CHECK IC SOLUTION LIMITED)