Texas Instruments

Description

C4. C3. OFFSET N2. (see Note A). ACTUAL DEVICE COMPONENT COUNT. COMPONENT. TLE2021. TLE2022. TLE2024 . Transistors. 40. 80. 160. Resistors. 7. This chip, when properly assembled, displays characteristics similar to the TLE2024 . Thermal compression or ultrasonic bonding may be used on the doped 2. TLE2022.302 Dual, precision, low power. TLE2024 . 5. 1. TLE2024 .5_1 Quad, precision, low power. TLE2024 . 5. 2. TLE2024 .5_2 Quad, precision, low power. best suited to our project because of its high common mode rejection ratio, which helps ensure a clean signal. 2. TLE2024 . (http://www.ti.com/product/tle202. 4). SOIC,. TSSOP. TLE2024 -Q1. High-Speed Low-Power Precision. Operational Amplifiers. 4. 4. 40. 1.7. 0.3. SOIC. TLC2264A-Q1. Rail-to-Rail Very Low Power.