Description
IC MCU ARM 3MB FLASH 337BGA Series: Hercules? TMS570 ARM? Cortex?-R Core Processor: ARM? Cortex?-R4F Core Size: 16/32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 120 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 16x12b, 24x12b Oscillator Type: External Operating Temperature: -40~C ~ 125~C Package / Case: 337-LFBGA Supplier Device Package: 337-NFBGA (16x16)
Part Number | TMS5703137CGWTQEP |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - Microcontrollers |
Brand | Texas Instruments |
Description | IC MCU 32BIT 3MB FLASH 337NFBGA |
Series | Hercules,TMS570 ARM Cortex-R |
Packaging | Tube |
Core Processor | ARM Cortex-R4F |
Core Size | 16/32-Bit |
Speed | 180MHz |
Connectivity | CAN, EBI/EMI, Ethernet, FlexRay, I²ÂC, LIN, MibSPI, SCI, SPI, UART/USART |
Peripherals | DMA, POR, PWM, WDT |
Number of I/O | 120 |
Program Memory Size | 3MB (3M x 8) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 256K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.14 V ~ 1.32 V |
Data Converters | A/D 16x12b, 24x12b |
Oscillator Type | External |
Operating Temperature | -40°C ~ 125°C (TA) |
Package / Case | 337-LFBGA |
Supplier Device Package | 337-NFBGA (16x16) |
Image |
TMS5703137CGWTQEP
TI/ST
8000
0.54
Shenzhen FULSI Technology Co., Ltd
TMS5703137CGWTQEP
TexasIns
5059
1.8775
HK HEQING ELECTRONICS LIMITED
TMS5703137CGWTQEP
TI/CC
20000
3.215
HK XINYI COMPONENTS ASIA CO., LIMITED
TMS5703137CGWTQEP
TI?
8924
4.5525
Shenzhen Dingyishun Technology Co., Ltd.
TMS5703137CGWTQEP
TI-BB
6444
5.89
MASSTOCK ELECTRONICS LIMITED