Description
IC DSP ARM SOC PBGA Series: 66AK2Ex KeyStone Multicore Type: DSP+ARM? Interface: EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, TSIP, UART, USB 3.0, USIM Clock Rate: 1.25GHz Non-Volatile Memory: ROM (256 kB) On-Chip RAM: 2MB Voltage - I/O: 1.35V, 1.5V, 1.8V, 3.3V Voltage - Core: Variable Operating Temperature: 0~C ~ 85~C Mounting Type: Surface Mount Package / Case: 1089-BFBGA, FCBGA Supplier Device Package: 1089-FCBGA (27x27)
Part Number | X66AK2E05XABD25 |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - DSP (Digital Signal Processors) |
Brand | Texas Instruments |
Description | IC DSP ARM SOC BGA |
Series | 66AK2Ex KeyStone Multicore |
Packaging | Tray |
Type | DSP+ARM |
Interface | EBI/EMI, Ethernet, DMA, I²ÂC, PCIe, SPI, TSIP, UART, USB 3.0, USIM |
Clock Rate | 1.25GHz |
Non-Volatile Memory | ROM (256 kB) |
On-Chip RAM | 2MB |
Voltage - I/O | 1.35V, 1.5V, 1.8V, 3.3V |
Voltage - Core | Variable |
Operating Temperature | 0°C ~ 85°C (TC) |
Mounting Type | Surface Mount |
Package / Case | 1089-BFBGA, FCBGA |
Supplier Device Package | 1089-FCBGA (27x27) |
Image |
X66AK2E05XABD25
TI/ST
100000
1.58
FUSION ELECTRONICS LTD
X66AK2E05XABD25
TexasIns
25860
2.2575
YU TUO (HONGKONG) TRADING CO., LIMITED
X66AK2E05XABD25
TI/CC
3000
2.935
HONG KONG YUE JIN PENG ELECTRONICS CO.
X66AK2E05XABD25
TI?
15000
3.6125
HongKong JDG Electronic Co., Limited
X66AK2E05XABD25
TI-BB
8821
4.29
Viassion Technology Co., Limited